Thermal Spreading Resistance Within a Compound Disk

This Javascript application calculates the thermal spreading resistance due to a flux applied over a circular portion of the upper surface of a compound disk. The disk consists of two layers having different thicknesses and thermal conductivities and heat flow through a uniform film coefficient over the lower surface to an ambient temperature is considered. The results for total one-dimensional conduction resistance, spreading resistance and total overall resistance are presented in both dimensional and dimensionless forms.

R* = 4 k1 a R

All calculations based on methods described in the following technical papers:
  1. M.M. Yovanovich, C.H. Tien and G.E. Schneider, "General Solution of Constriction Resistance Within a Compound Disk," Heat Transfer, Thermal Control and Heat Pipes, AIAA Progress in Astronautics and Aeronautics, Vol. 70, 1980
  2. M.M. Yovanovich, J.R. Culham and P. Teertstra, "Modeling Thermal Resistance of Diamond Spreader on Copper Heat Sink Systems," presented at the IEPS Electronics Packaging Conference, Sept. 29 - Oct. 1, Austin, TX, 1996.
Instructions
  1. Enter input values in the table on the left
  2. Browser will calculate when the Calculate button is clicked or when the number of significant digits is changes.
  3. Depending on the speed of your machine and the number of terms, the solution may take a while to compute.


Input Values

Layer 1
Thermal Conductivity - k1 (W/mK)
Thickness - t1 (mm)
Layer 2
Thermal Conductivity - k2 (W/mK)
Thickness - t2 (mm)
Source Radius - a (mm)
Disk Radius - b (mm)
Source Boundary
Condition
Film Coefficient - h (W/m2K)
Number of Terms


Results
Dimensionless
Dimensional
( oC/W)
One-D
Resistance
Spreading
Resistance
Total
Resistance

Number of Digits
Copyright © 2000 Microelectronics Heat Transfer Laboratory